Pad printing machine for the production of electrically conductive layers
As part of a cooperation project with Chemnitz University of Technology, we developed a new pad printing machine for the in-mould application of electrically conductive layers.
The core idea of the project, funded by the German Federal Environmental Foundation (DBU), was to apply electrically conductive layers already during the manufacturing process of the component. This represents a new method that significantly increases both the efficiency and sustainability of the process.
Novel method for producing conductive layers
The new modular pad printing machine enables circuit patterns to be printed directly onto the mold wall of the injection molding machine before the plastic melt flows over the printed pattern and embeds it into the component. For this purpose, the pad printing system was installed directly onto the injection molding machine.
When the mold is open, the system can print circuit patterns directly onto the mold surface. A key role is played by a short-wave infrared emitter, which pre-dries the printed motif in order to ensure optimal transfer of the conductive layer onto the forming plastic component.

